DK200/DK200P

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DK200/DK200P


■ PN curing, Tg greater than 190 ℃<br />■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability<br />■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

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