DK1670GC/DK1670GP

■ Halogen-free (Cl or Br<900ppm) 、Tg value > 170℃、CTI value≥600V
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes

Application

New energy vehicles, computers, instrumentation, communication equipment, office equipment, etc.

Tg

175

Td

370

CTE

2.4

Details

Test Items unit
Test Condition
Typical value Specification
Tg °C DSC 175 ≥170
Z-axis CTE ppm/°C <Tg 45 ≤60
ppm/°C >Tg 210 ≤300
% 50-260°C 2.4 ≤3.0
Surface Resistivity After moisture resistance 3.5X10E6 ≥10E4
E-24/ 125 2.5X10E6 ≥10E3
Volume Resistivity MΩ·cm After moisture resistance 3.8X10E7 ≥10E4
E-24/ 125 2.7X10E7 ≥10E3
Dielectric Constant  1MHz - C-24/23/50 4.5 ≤5.4

Dissipation Factor1MHz

- C-24/23/50 0.012 ≤0.035
Arc Resistance sec D-48/50+D-0.5/23 135 ≥60
Dielectric Breakdown  KV D-48/50+D-0.5/23 45+KV NB ≥40
Water Absorption % D-24/23 0.1 ≤0.8
Flamemability - C-24/23/50+E-24/125 94V-0 94V-0
Td °C 10°C/MIN, N2, 5%Wt Loss 370 ≥340
T288 min TMA >60 ≥15
Peel Strength(HTE 1OZ) N/mm 125°C 、Float288°C/10Sec 1.2、 1.3 ≥0.7、≥1.05
Thermal Stress Unetched sec Float288°C/10Sec >120 ≥10
Etched
Bending Strength Length Direction N/mm2 A 510 ≥415
Cross Direction N/mm2 A 435 ≥345
Compared Tracking Index(CTI) V IEC60112Method PLC 0 PLC 0

 

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