DK1670GC/DK1670GP
■ Halogen-free (Cl or Br<900ppm) 、Tg value > 170℃、CTI value≥600V
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes
Category:
Application
New energy vehicles, computers, instrumentation, communication equipment, office equipment, etc.
Tg
175
Td
370
CTE
2.4
Details
| Test the project | unit | Processing conditions | Typical value | Specification value | |
|---|---|---|---|---|---|
| Tg | °C | DSC | 175 | ≥170 | |
| Z-axis CTE | ppm/°C | <Tg | 45 | ≤60 | |
| ppm/°C | >Tg | 210 | ≤300 | ||
| % | 50-260°C | 2.4 | ≤3.0 | ||
| Surface resistivity | MΩ | After moisture resistance | 3.5X10E6 | ≥10E4 | |
| E-24/ 125 | 2.5X10E6 | ≥10E3 | |||
| Volume resistivity | MΩ·cm | After moisture resistance | 3.8X10E7 | ≥10E4 | |
| E-24/ 125 | 2.7X10E7 | ≥10E3 | |||
| Dielectric constant 1MHz | - | C-24/23/50 | 4.5 | ≤5.4 | |
| Dielectric loss 1MHz | - | C-24/23/50 | 0.012 | ≤0.035 | |
| Arc resistance | sec | D-48/50+D-0.5/23 | 135 | ≥60 | |
| Breakdown voltage | KV | D-48/50+D-0.5/23 | 45+KV,NB | ≥40 | |
| Water absorption | % | D-24/23 | 0.1 | ≤0.8 | |
| Flame retardant | - | C-24/23/50+E-24/125 | 94V-0 | 94V-0 | |
| Thermal decomposition temperature | °C | 10°C/MIN, N2, 5%Wt Loss | 370 | ≥340 | |
| T288 | min | TMA | >60 | ≥15 | |
| Peel strength(HTE 1OZ) | N/mm | 125°C 、Float288°C/10Sec | 1.2、 1.3 | ≥0.7、≥1.05 | |
| Thermal stress | Unetched | sec | Float288°C/10Sec | >120 | ≥10 |
| etched | |||||
| Bending strength | Length Direction | N/mm2 | A | 510 | ≥415 |
| Cross Direction | N/mm2 | A | 435 | ≥345 | |
| Compared to tracking index | V | IEC60112Method | PLC 0 | PLC 0 | |
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