DK1670GC/DK1670GP

■ Halogen-free (Cl or Br<900ppm) 、Tg value > 170℃、CTI value≥600V
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes

Application

New energy vehicles, computers, instrumentation, communication equipment, office equipment, etc.

Tg

175

Td

370

CTE

2.4

Details

Test the project unit Processing conditions Typical value Specification value
Tg °C DSC 175 ≥170
Z-axis CTE ppm/°C <Tg 45 ≤60
ppm/°C >Tg 210 ≤300
% 50-260°C 2.4 ≤3.0
Surface resistivity After moisture resistance 3.5X10E6 ≥10E4
E-24/ 125 2.5X10E6 ≥10E3
Volume resistivity MΩ·cm After moisture resistance 3.8X10E7 ≥10E4
E-24/ 125 2.7X10E7 ≥10E3
Dielectric constant  1MHz - C-24/23/50 4.5 ≤5.4
Dielectric loss 1MHz - C-24/23/50 0.012 ≤0.035
Arc resistance sec D-48/50+D-0.5/23 135 ≥60
Breakdown voltage KV D-48/50+D-0.5/23 45+KV,NB ≥40
Water absorption % D-24/23 0.1 ≤0.8
Flame retardant - C-24/23/50+E-24/125 94V-0 94V-0
Thermal decomposition temperature °C 10°C/MIN, N2, 5%Wt Loss 370 ≥340
≥340
T288 min TMA >60 ≥15
Peel strength N/mm 125°C 、Float288°C/10Sec 1.2、 1.3 ≥0.7、≥1.05
Thermal stress Unetched sec Float288°C/10Sec >120 ≥10
etched
Bending strength Length Direction N/mm2 A 510 ≥415
Cross Direction N/mm2 A 435 ≥345
Compared to tracking index V IEC60112Method PLC 0 PLC 0

 

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