DK1650GC/DK1650GP

■ Halogen-free (Cl or Br<900ppm) 、Tg value > 150℃、CTI value≥600V
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes

Application

New energy vehicles, computers, instrumentation, communication equipment, etc.

Tg

155

Td

370

CTE

2.8

Details

Test the project unit Processing conditions Typical value Specification value
Tg °C DSC 155 ≥150
Z-axis CTE ppm/°C <Tg 45 ≤60
ppm/°C >Tg 238 ≤300
% 50-260°C 2.8 ≤3.5
Surface resistivity After moisture resistance 3.0X10E7 ≥10E4
≥10E4
Volume resistivity MΩ·cm After moisture resistance 8.2X10E7 ≥10E6
≥10E6
Dielectric constant  1MHz - C-24/23/50 4.47 ≤5.4
Dielectric loss 1MHz - C-24/23/50 0.08 ≤0.035
Arc resistance sec D-48/50+D-0.5/23 181 ≥60
Breakdown voltage KV D-48/50+D-0.5/23 45+KV,NB ≥40
Water absorption % D-24/23 0.13 ≤0.5
Flame retardant - C-24/23/50+E-24/125 94V-0 94V-0
Thermal decomposition temperature °C 10°C/MIN, N2, 5%Wt Loss 370 ≥325
≥325
T288 min TMA >60 ≥5
T260 min TMA >60 ≥30
Peel strength N/mm 125°C 、Float288°C/10Sec 1.2、 1.5 ≥0.7、≥1.05
Thermal stress Unetched sec Float288°C/10Sec 150 ≥10
etched
Bending strength Length Direction N/mm2 A 532 ≥415
Cross Direction N/mm2 A 434 ≥345
Compared to tracking index V IEC60112Method PLC 0 PLC 0

 

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