DK1650GC/DK1650GP
■ Excellent CAF resistance
■ Excellent mechanical processibility andthermal resistance
■ Low Z-CTE, lead free process compliancy
Category:
Application
New energy vehicles, computers, instrumentation, communication equipment, etc.
Tg
155
Td
370
CTE
2.8
Details
| Test Items | Units | Test Condition | Typical Value | Specification | |
|---|---|---|---|---|---|
Tg | °C | DSC | 155 | ≥150 | |
Z-axis CTE | ppm/°C | <Tg | 45 | ≤60 | |
ppm/°C | >Tg | 238 | ≤300 | ||
% | 50-260°C | 2.8 | ≤3.5 | ||
Surface Resistance | MΩ | After moisture resistance | 3.0X10E7 | ≥10E4 | |
Volume Resistance | MΩ·cm | After moisture resistance | 8.2X10E7 | ≥10E4 | |
Dielectric Constant 1GHz | - | C-24/23/50 | 4.47 | ≤5.4 | |
Dissipation Factor 1GHz | - | C-24/23/50 | 0.008 | ≤0.035 | |
Arc Resistance | sec | D-48/50+D-0.5/23 | 181 | ≥60 | |
Dielectric Breakdown | KV | D-48/50+D-0.5/23 | 45+KV,NB | ≥40 | |
Water Absorption | % | D-24/23 | 0.13 | ≤0.5 | |
Flammability | - | C-24/23/50+E-24/125 | 94V-0 | 94V-0 | |
Td | °C | 10°C/MIN, N2, 5%Wt Loss | 370 | ≥325 | |
T288 | min | TMA | >60 | ≥5 | |
T260 | min | TMA | >60 | ≥30 | |
Peel Strength(HTE 1OZ) | N/mm | 125°C | 1.25 | ≥0.7 | |
Float288°C/10Sec | 1.3 | ≥1.05 | |||
Thermal Stress | Unetched | sec | Float288°C/10Sec | 150 | ≥10 |
Etched | |||||
Flexural Strength | Length Direction | N/mm2 | A | 532 | ≥415 |
Cross Direction | N/mm2 | A | 434 | ≥345 | |
Comparative Tracking Index (CTI) | V | IEC60112Method | PLC 0 | PLC 0 | |
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