Dekai Industry
Products
DK160/DK160P
■ Exhibits excellent heat resistance, featuring a low coefficient of thermal expansion, superior through-hole capability, and outstanding CAF resistance.
■ Meets the specification requirements of IPC-4101/99 (lead-free, high Td, low thermal expansion coefficient)
Category：
Application
Mini Led, computer, instrument, communication equipment, car, camera, etc.
Tg
155
Td
370
CTE
2.6
Details
| Test Item | Unit | Handling conditions | Typical value | Specification value | |
|---|---|---|---|---|---|
| Tg | °C | DSC | 155 | ≥150 | |
| Z-axis CTE | ppm/°C | |
47 | ≤60 | |
| ppm/°C | >TG | 200 | ≤300 | ||
| % | 50–260°C | 2.6 | ≤3.5 | ||
| Surface resistivity | MΩ | A | 3.2X10E7 | - | |
| Volume Resistivity | MΩ·cm | A | 4.6X10E8 | - | |
| Dielectric constant at 1 MHz | - | C-24/23/50 | 4.7 | ≤5.4 | |
| Dielectric loss at 1 MHz | - | C-24/23/50 | 0.014 | ≤0.035 | |
| Arc resistance | Sec | D-48/50 + D-0.5/23 | 180 | ≥60 | |
| Breakdown voltage | KV | D-48/50 + D-0.5/23 | 45+KV, NB | ≥40 | |
| Water absorption rate | % | D-24/23 | 0.11 | ≤0.5 | |
| Flame retardancy | - | C-48/23/50 | 94V-0 | 94V-0 | |
| Td thermal decomposition temperature | °C | 10°C/MIN, N2, 5% Weight Loss | 370 | ≥325 | |
| T288 | min | TMA | >40 | ≥5 | |
| T260 | min | TMA | >60 | ≥30 | |
| Peel Strength (HTE 1OZ) | N/mm | 125°C | 1.6 | ≥0.7 | |
| Float at 288°C for 10 seconds | 1.7 | ≥1.05 | |||
| Thermal stress | Unetched | Sec | Float at 288°C for 10 seconds | >120 | ≥10 |
| Etched | |||||
| Flexural strength | Length Direction | N/mm2 | A | 515 | ≥415 |
| Cross-Direction | N/mm2 | A | 415 | ≥345 | |
| Compared to the electric tracking index | V | IEC60112Method | PLC 3 | - | |
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