DK160/DK160P

■ PN curing, using special resin cross-linked Tg>150°C
■ Excellent heat resistance, low coefficient of thermal expansion and superior through-hole capability and anti-CAF capability
■ Meets IPC-4101/99 specifications (lead-free, high Td, low coefficient of thermal expansion)

Application

Mini Led, computer, instrument, communication equipment, car, camera, etc.

Tg

155

Td

378

CTE

2.8

Details

Test Item Unit Treatment conditions Typical value Specification value
Tg °C DSC 155 ≥ 150
Z-axis CTE ppm/°C <Tg 47 ≤ 60
ppm/°C >Tg 237 ≤ 300
% 50-260°C 2.8 ≤ 3.5
surface resistivity After moisture resistance 2.7X10E8 ≥ 10E4
E-24/125 5.3X10E5 ≥ 10E3
volume resistivity MΩ· cm After moisture resistance 1.2X10E9 ≥ 10E6
E-24/125 3.1X10E6 ≥ 10E3
Dielectric constant 1MHz - C- 24/23/50 4.6 ≤ 5.4
Dielectric loss 1MHz - C- 24/23/50 0.01 ≤ 0.035
Arc resistance sec D-48/50 D-0.5/23 180 ≥ 60
breakdown voltage KV D-48/50 D-0.5/23 45 KV,NB ≥ 40
water absorption % D-24/23 0.13 ≤ 0.5
Flame resistance - C- 24/23/50 E-24/125 94V-0 94V-0
Td thermal decomposition temperature °C 10°C/MIN,N2,5%Wt Loss 378 ≥ 325
T288 min TMA >60 ≥ 5
T260 min TMA >60 ≥ 30
Peel strength (HTE 1OZ) N/mm 125°C 1.1 ≥ 0.7
Float288 °C/10Sec 1.1 ≥ 1.05
thermal stress unetched Sec Float288 °C/10Sec >300 ≥ 10
Etched
bending strength Length Direction N/mm2 A 1191 ≥ 415
Cross Direction N/mm2 A 912 ≥ 345
Compared to the electrical tracking index V IEC60112Method PLC 2 -

 

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