Dekai Industry
Products
DK150GC/DK150GP
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process
Category：
Application
Smart phones, tablet computers, automotive electronics, communication equipment, etc.
Tg
153
Td
400
CTE
2.9
Details
| Test Item | Unit | Treatment conditions | Typical value | Specification value | |
|---|---|---|---|---|---|
| Tg | °C | DSC | 153 | ≥ 150 | |
| Z-axis CTE | ppm/°C | <Tg | 47 | ≤ 60 | |
| ppm/°C | >Tg | 237 | ≤ 300 | ||
| % | 50-260°C | 2.9 | ≤ 3.5 | ||
| surface resistivity | MΩ | After moisture resistance | 2.7X10E9 | ≥ 10E4 | |
| E-24/ 125 | 5.3X10E10 | ≥ 10E3 | |||
| volume resistivity | MΩ· cm | After moisture resistance | 1.2X10E9 | ≥ 10E6 | |
| E-24/ 125 | 3.1X10E7 | ≥ 10E3 | |||
| Dielectric constant 1MHz | - | C- 24/23/50 | 4.6 | ≤ 5.4 | |
| Dielectric loss 1MHz | - | C- 24/23/50 | 0.01 | ≤ 0.035 | |
| Arc resistance | sec | D-48/50+ D-0.5/23 | 180 | ≥ 60 | |
| breakdown voltage | KV | D-48/50+ D-0.5/23 | 45 +KV,NB | ≥ 40 | |
| water absorption | % | D-24/23 | 0.13 | ≤ 0.5 | |
| Flame resistance | - | C- 24/23/50+ E-24/125 | 94V-0 | 94V-0 | |
| Td thermal decomposition temperature | °C | 10°C/MIN, N2, 5%Wt Loss | 400 | ≥ 325 | |
| T288 | min | TMA | >60 | ≥ 5 | |
| T260 | min | TMA | >60 | ≥ 30 | |
| Peel strength (HTE HOZ) | N/mm | 125 °c 、 float288 °c/10sec | 1.1、 1.1 | ≥ 0.7 、 ≥ 1.05 | |
| thermal stress | unetched | sec | Float288 °C/10Sec | >300 | ≥ 10 |
| Etched | |||||
| bending strength | Length Direction | N/mm2 | A | 540 | ≥ 415 |
| Cross Direction | N/mm2 | A | 474 | ≥ 345 | |
| Compared to the electrical tracking index | V | IEC60112Method | PLC 2 | - | |
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