DK150GC/DK150GP

■ Halogen-free (Cl or Br<900ppm)
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process

Application

Smart phones, tablet computers, automotive electronics, communication equipment, etc.

Tg

153

Td

407

CTE

2.9

Details

Test Item Unit Treatment conditions Typical value Specification value
Tg °C DSC 153 ≥ 150
Z-axis CTE ppm/°C <Tg 47 ≤ 60
ppm/°C >Tg 237 ≤ 300
% 50-260°C 2.9 ≤ 3.5
surface resistivity After moisture resistance 2.7X10E9 ≥ 10E4
E-24/ 125 5.3X10E10 ≥ 10E3
volume resistivity MΩ· cm After moisture resistance 1.2X10E9 ≥ 10E6
E-24/ 125 3.1X10E7 ≥ 10E3
Dielectric constant 1MHz - C- 24/23/50 4.6 ≤ 5.4
Dielectric loss 1MHz - C- 24/23/50 0.01 ≤ 0.035
Arc resistance sec D-48/50 D-0.5/23 180 ≥ 60
breakdown voltage KV D-48/50 D-0.5/23 45 KV,NB ≥ 40
water absorption % D-24/23 0.13 ≤ 0.5
Flame resistance - C- 24/23/50 E-24/125 94V-0 94V-0
Td thermal decomposition temperature °C 10°C/MIN, N2, 5%Wt Loss 407 ≥ 325
≥ 325
T288 min TMA >60 ≥ 5
T260 min TMA >60 ≥ 30
Peel strength N/mm 125 °c 、 float288 °c/10sec 1.1、 1.1 ≥ 0.7 、 ≥ 1.05
thermal stress unetched sec Float288 °C/10Sec >300 ≥ 10
Etched
bending strength Length Direction N/mm2 A 1191 ≥ 415
Cross Direction N/mm2 A 912 ≥ 345
Compared to the electrical tracking index V IEC60112Method PLC 2 -

 

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