Dekai Industry
Products
DK200/DK200P
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)
Category：
Application
Suitable for high multilayer PCB, computer, communication, automotive electronics, etc
Tg
195
Td
360
CTE
2.2
Details
Test Items | Units | Test Condition | Typical Value | Specification | |
|---|---|---|---|---|---|
Tg | °C | DSC | 195 | ≥ 170 | |
Z-axis CTE | ppm/°C | <Tg | 45 | ≤ 60 | |
ppm/°C | >Tg | 210 | ≤ 300 | ||
% | 50-260°C | 2.2 | ≤ 3.0 | ||
Surface Resistance | MΩ | E-24/125 | 3.5X10E6 | 10E3 | |
Volume Resistance | MΩ· cm | E-24/125 | 6.3X10E8 | 10E3 | |
Dielectric Constant 1MHz | - | C- 24/23/50 | 4.5 | ≤ 5.4 | |
Dissipation Factor 1MHz | - | C- 24/23/50 | 0.013 | ≤ 0.035 | |
Arc Resistance | sec | D-48/50+ D-0.5/23 | 139 | ≥ 60 | |
Dielectric Breakdown | KV | D-48/50+ D-0.5/23 | 45+ KV NB | ≥ 40 | |
Water Absorption | % | D-24/23 | 0.13 | ≤ 0.5 | |
Flammability | - | C- 24/23/50+ E-24/125 | 94V-0 | 94V-0 | |
Td | °C | 10°C/MIN,N2,5%Wt Loss | ＞360 | ≥ 340 | |
T288 | min | TMA | >60 | ≥ 15 | |
T260 | min | TMA | >60 | ≥ 30 | |
Peel strength (HTE 1OZ) | N/mm | 125°C | 1.4 | ≥ 0.7 | |
Float288 °C/10Sec | 1.6 | ≥ 1.05 | |||
Thermal Stress | Unetched | Sec | Float288 °C/10Sec | >300 | ≥ 10 |
Etched | |||||
Flexural Strength | Length Direction | N/mm2 | A | 547 | ≥ 415 |
Cross Direction | N/mm2 | A | 436 | ≥ 345 | |
Comparative Tracking Index(CTI) | V | IEC60112Method | PLC 3 | PLC 3 | |
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