DK200/DK200P

■ PN curing, Tg greater than 190 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Suitable for high multilayer PCB, computer, communication, automotive electronics, etc

Tg

195

Td

373

CTE

2.2

Details

Test Item Unit Treatment conditions Typical value Specification value
Tg °C DSC 195 ≥ 170
Z-axis CTE ppm/°C <Tg 45 ≤ 60
ppm/°C >Tg 210 ≤ 300
% 50-260°C 2.2 ≤ 3.0
surface resistivity E-24/125 8.3X10E6 10E3
10E3
volume resistivity MΩ· cm E-24/125 2.5X10E7 10E3
10E3
Dielectric constant 1MHz - C- 24/23/50 4.7 ≤ 5.4
Dielectric loss 1MHz - C- 24/23/50 0.015 ≤ 0.035
Arc resistance sec D-48/50 D-0.5/23 150 ≥ 60
breakdown voltage KV D-48/50 D-0.5/23 45 KV,NB ≥ 40
water absorption % D-24/23 0.13 ≤ 0.5
Flame resistance - C- 24/23/50 E-24/125 94V-0 94V-0
Td thermal decomposition temperature °C 10°C/MIN,N2,5%Wt Loss 373 ≥ 340
T288 min TMA >60 ≥ 5
T260 min TMA >60 ≥ 30
Peel strength (HTE 1OZ) N/mm 125°C 1.4 ≥ 0.7
Float288 °C/10Sec 1.6 ≥ 1.05
thermal stress unetched Sec Float288 °C/10Sec >300 ≥ 10
Etched
bending strength Length Direction N/mm2 A 533 ≥ 415
Cross Direction N/mm2 A 408 ≥ 345
Compared to the electrical tracking index V IEC60112Method PLC 3 PLC 3

 

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