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CTE

condition:

clear condition

DK1600/DK1600P

Features

■ Tetrafunctional epoxy resin is designed for higher UV-Blocking, better dimensional stability and through hole capability
■ Excellent tracking resistance, CTI≧ 600V
■Excellent mechanical properties, electrical properties, chemical properties
■ Compliant with IPC-4101/97

Application

Plasma, LCD, power substrate, TV, washing machine, etc.

Description

DK1600 CCL-MSDS.pdf

DK1600 PP-MSDS.pdf

DK1600Product Processing Guide.pdf

DK1600 TDS.pdf

DK-C140/DK-P140

Features

■ Tetrafunctional epoxy resins are designed for higher UV-Blocking, better dimensional stability and through-hole capability.
■ Low water absorption, UV-block and AOI compatible, flame retardant up to UL 94V-0
■Excellent heat resistance, mechanical properties, electrical properties, chemical properties
■ Compliant with IPC-4101/97

Application

Computer, instrument, communication equipment, automotive electronics, power supply, etc.

Description

DK-C140 CCL-MSDS.pdf

DK-P140 PP-MSDS.pdf

DK-C140 Product Processing Guide.pdf

DK-C140 TDS.pdf

DK140F/DK140FP

Features

■ Tg 135±5 ℃, lead-free compatible FR-4.0 sheet
■ Low water absorption, UV-blocking and AOI compatible, flame retardant up to UL 94V-0
■Excellent heat resistance, low thermal expansion coefficient, good resistance to CAF
■ Comply with the specification requirements of IPC-4101/101.

Application

Automotive electronics, instrumentation, communication equipment, power supply, etc.

Description

DK140F Product Processing Guide.pdf

Features

■ PN curing, Tg greater than 150 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/99 specifications (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Computers, instruments, communication equipment, automobiles, cameras, etc.

Description

DK-P150 PP-MSDS.pdf

DK-C150 CCL-MSDS.pdf

DK-C150 Product Processing Guide.pdf

DK-C150 TDS.pdf

DK160/DK160P

Features

■ PN curing, utilizing a special resin crosslinking with Tg > 150°C
■ Exhibits excellent heat resistance, featuring a low coefficient of thermal expansion, superior through-hole capability, and outstanding CAF resistance.
■ Meets the specification requirements of IPC-4101/99 (lead-free, high Td, low thermal expansion coefficient)

Application

Mini Led, computer, instrument, communication equipment, car, camera, etc.

Description

Features

■PN cured, Tg greater than 170°C
■ Excellent heat resistance, low Z-direction thermal expansion coefficient, and superior through-hole capability
■ Meets the requirements of IPC-4101/126 standards (lead-free, high Td, low Z-axis thermal expansion coefficient, CAF-resistant)

Application

Computer and communication equipment, high-end instruments, routers, etc.

Description

DK-C170 CCL-MSDS.pdf

DK-P170 PP-MSDS.pdf

DK-C170 Product Processing Guide.pdf

DK-C170 TDS.pdf

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Tel：+86-023-52205000

Email：HR01@dekgf.com

Fax：+86-023-52205488

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Telephone：+86-0752-3532018

Fax：+86-0752-3532028

Email：MKT02@dekgf.com