Tg
Td
CTE
condition:
clear condition

Features

■ Tg 135±5 ℃, lead-free compatible FR-4.0 sheet
■ Low water absorption, UV-blocking and AOI compatible, flame retardant up to UL 94V-0
■Excellent heat resistance, low thermal expansion coefficient, good resistance to CAF
■ Comply with the specification requirements of IPC-4101/101.

Application

Automotive electronics, instrumentation, communication equipment, power supply, etc.

Features

■ PN curing, Tg greater than 150 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/99 specifications (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Computers, instruments, communication equipment, automobiles, cameras, etc.

Features

■ PN curing, utilizing a special resin crosslinking with Tg > 150°C
■ Exhibits excellent heat resistance, featuring a low coefficient of thermal expansion, superior through-hole capability, and outstanding CAF resistance.
■ Meets the specification requirements of IPC-4101/99 (lead-free, high Td, low thermal expansion coefficient)

Application

Mini Led, computer, instrument, communication equipment, car, camera, etc.

Features

■PN cured, Tg greater than 170°C
■ Excellent heat resistance, low Z-direction thermal expansion coefficient, and superior through-hole capability
■ Meets the requirements of IPC-4101/126 standards (lead-free, high Td, low Z-axis thermal expansion coefficient, CAF-resistant)

Application

Computer and communication equipment, high-end instruments, routers, etc.

Features

■ PN curing, Tg greater than 190 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Suitable for high multilayer PCB, computer, communication, automotive electronics, etc
< 1 > proceed page