DK-C170/DK-P170

■ PN curing, Tg greater than 170 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Computer and communication equipment, high-end instruments, routers, etc.

Tg

177

Td

372

CTE

2.4

Details

Test Item Unit Treatment conditions Typical value Specification value
Tg °C DSC 177 ≥ 150
Z-axis CTE ppm/°C <Tg 47 ≤ 60
ppm/°C >Tg 206 ≤ 300
% 50-260°C 2.4 ≤ 3.5
surface resistivity E-24/125 2.5X10E6 ≥ 10E4
≥ 10E3
volume resistivity MΩ· cm E-24/125 3.3X10E8 ≥ 10E6
≥ 10E3
Dielectric constant 1MHz - C- 24/23/50 4.7 ≤ 5.4
Dielectric loss 1MHz - C- 24/23/50

0.013

≤ 0.035
Arc resistance sec D-48/50 D-0.5/23 134 ≥ 60
breakdown voltage KV D-48/50 D-0.5/23 45 KV,NB ≥ 40
water absorption % D-24/23 0.13 ≤ 0.5
Flame resistance - C- 24/23/50 E-24/125 94V-0 94V-0
Td thermal decomposition temperature °C 10°C/MIN,N2,5%Wt Loss 372 ≥ 340
T288 min TMA >60 ≥ 15
T260 min TMA >60 ≥ 30
Peel strength (HTE 1OZ) N/mm 125°C 1.4 ≥ 0.7
Float288 °C/10Sec 1.6 ≥ 1.05
thermal stress unetched Sec Float288 °C/10Sec >120 ≥ 10
Etched
bending strength Length Direction N/mm2 A 502 ≥ 415
Cross Direction N/mm2 A 415 ≥ 345
Compared to the electrical tracking index V IEC60112Method PLC 3 PLC 3

 

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