Dekai Industry
Products
DK-C170/DK-P170
■ Excellent heat resistance, low Z-direction thermal expansion coefficient, and superior through-hole capability
■ Meets the requirements of IPC-4101/126 standards (lead-free, high Td, low Z-axis thermal expansion coefficient, CAF-resistant)
Category：
Application
Computer and communication equipment, high-end instruments, routers, etc.
Tg
177
Td
372
CTE
2.4
Details
| Test Items | Units | Handling Condition | Typical value | Specification | |
|---|---|---|---|---|---|
Tg | ℃ | DSC | 177 | ≥170 | |
Z-axis CTE | ppm/℃ | ＜Tg | 47 | ≤60 | |
ppm/℃ | >TG | 206 | ≤300 | ||
% | 50–260℃ | 2.4 | ≤3.0 | ||
Surface Resistance | MΩ | E-24/125 | 2.5X10E6 | ≥10E3 | |
Volume Resistance | MΩ·cm | E-24/125 | 3.3X10E8 | ≥10E3 | |
Dielectric Constant 1MHz | - | C-24/23/50 | 4.7 | ≤5.4 | |
Dielectric Factor 1MHz | - | C-24/23/50 | 0.013 | ≤0.035 | |
Arc Resistance | Sec | D-48/50+ D-0.5/23 | 134 | ≥60 | |
Dielectric Breakdown | KV | D-48/50+ D-0.5/23 | 45+KV NB | ≥40 | |
Water Absorption | % | D-24/23 | 0.14 | ≤0.5 | |
Flammability | - | C-24/23/50 + E-24/125 | 94V-0 | 94V-0 | |
Td | ℃ | 10℃/MIN, N2, 5% Weight Loss | 372 | ≥340 | |
T288 | min | TMA | >60 | ≥15 | |
T260 | min | TMA | >60 | ≥30 | |
Peel Strength (HTE 1OZ) | N/mm | 125℃ | 1.4 | ≥0.7 | |
Float at 288℃ for 10 seconds | 1.6 | ≥1.05 | |||
Thermal Stress | Unetched | Sec | Float at 288℃ for 10 seconds | >120 | ≥10 |
Etched | |||||
Flexural Strength | Length Direction | N/mm2 | A | 502 | ≥415 |
Cross Direction | N/mm2 | A | 415 | ≥345 | |
Comparative Tracking Index | V | IEC60112Method | PLC 3 | PLC 3 | |
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