Open source securities: copper-clad industry bottoming signal has now turned strong demand to push prices upward

2023-07-03 15:31

Zhitong Financial APP learned that Kaiyuan Securities released a research report saying that the inventory of copper clad laminate industry has been completely depleted and the bottom of the industry appears: 1) the turnover days of the industry inventory belong to the low water level in the electronic subdivision sector; 2) The copper clad laminate industry has completed inventory de-stocking in 2022Q3; 3) The industry's growth rate has reached the low point of 2022Q3, and 2022Q4-2023Q1 continues to repair. 4) The price bottom has appeared. In addition, according to the Prismark forecast, 2023Q2 downstream PCB link single-quarter output value is expected to stabilize back to $19.1 billion, QoQ plus 5.9 percent, the bank believes that the downstream link demand boost will help the copper plate link continue to raise prices to repair profits and obtain excess profits.
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2023-07

The main purpose of copper clad laminate

Traditional copper clad laminates are mainly used to manufacture printed circuit boards for supporting and interconnecting and insulating electronic components. They are called important basic materials for printed circuit boards. It is an indispensable and important electronic material for all electronic products, including aviation, aerospace, remote sensing, telemetry, remote control, communications, computers, industrial control, household appliances, and even advanced children's toys. With the continuous improvement of the level of science and technology, in recent years, some special electronic copper clad laminates are also used to directly manufacture printed electronic components.

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2023-07

Introduction of copper clad laminate

Copper Clad Laminate (Copper Clad Laminate,CCL) is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing, referred to as copper clad laminate. Printed circuit boards of various forms and functions are selectively processed, etched, drilled and copper plated on copper clad laminates to make different printed circuits. The printed circuit board mainly plays the role of interconnection, insulation and support, and has a great influence on the signal transmission speed, energy loss and characteristic impedance in the circuit. Therefore, the performance, quality, and manufacturing of the printed circuit board The processability, manufacturing level, manufacturing cost, and long-term reliability and stability depend to a large extent on the copper clad laminate.

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2023-07

Common materials for copper clad laminate

FR-1-phenolic cotton paper, this substrate is known as bakelite (higher economy than FR-2)

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2023-07

Common types and characteristics of copper clad laminate

1. Copper foil-clad phenolic paper laminate is a laminate made of insulating impregnated paper (TFz-62) or cotton fiber impregnated paper (1TZ-63) impregnated with phenolic resin by hot pressing. The two surface adhesive paper can be attached with a single sheet of alkali-free glass impregnated tape, and one side is coated with copper foil. It is mainly used as a circuit board in radio equipment.

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2023-07

What are the commonly used types of copper clad laminate?

The main material of the circuit board is copper clad laminate, and copper clad laminate (copper clad) is composed of substrate, copper foil and adhesive. The substrate is an insulating laminate composed of polymer synthetic resin and reinforcing materials. The surface of the substrate is covered with a layer of pure copper foil with high conductivity and good weldability, usually with a thickness of 18μm ~ 35μm ~ 50μm; The copper clad laminate covered with copper foil on one side of the substrate is called single-sided copper clad laminate, and the copper clad laminate covered with copper foil on both sides of the substrate is called double-sided copper clad laminate. Whether the copper foil can be firmly covered on the substrate is completed by the adhesive. The thickness of commonly used copper clad laminate is 1.0mm, 1.5mm and 2.0mm.

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2023-07

First knowledge of copper clad laminate: you need to know the basic knowledge of copper clad laminate

Copper clad laminate refers to a piece of substrate, by chemical or mechanical means on the surface of the production of a layer of copper foil, in order to make the circuit on it. Copper clad laminate has electrical conductivity and good welding performance, as well as excellent mechanical strength and corrosion resistance. Therefore, it is one of the basic materials commonly used in the electronics industry.