DK-C150/DK-P150

■ PN curing, Tg greater than 150 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/99 specifications (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Computers, instruments, communication equipment, automobiles, cameras, etc.

Tg

155

Td

378

CTE

2.8

Details

Test Item Unit Treatment conditions Typical value Specification value
Tg °C DSC 155 ≥ 150
Z-axis CTE ppm/°C <Tg 58 ≤ 60
ppm/°C >Tg 245 ≤ 300
% 50-260°C 2.8 ≤ 3.5
surface resistivity After moisture resistance 2.9X10E7 ≥ 10E3
≥ 110E3
volume resistivity MΩ· cm After moisture resistance 4.9X10E8 ≥ 10E3
≥ 10E3
Dielectric constant 1MHz - C- 24/23/50 4.7 ≤ 5.4
Dielectric loss 1MHz - C- 24/23/50 0.014 ≤ 0.035
Arc resistance sec D-48/50 D-0.5/23 181 ≥ 60
breakdown voltage KV D-48/50 D-0.5/23 45 KV,NB ≥ 40
water absorption % D-24/23 0.13 ≤ 0.5
Flame resistance - C- 24/23/50 E-24/125 94V-0 94V-0
Td thermal decomposition temperature °C 10°C/MIN, N2, 5%Wt Loss 378 ≥ 325
≥ 325
T288 min TMA >60 ≥ 5
T260 min TMA >60 ≥ 30
Peel strength N/mm

125°C

Float288 °C/10Sec

1.4

1.6

≥ 0.7

≥ 1.05

thermal stress unetched sec Float288 °C/10Sec >120 ≥ 10
Etched
bending strength Length Direction N/mm2 A 509 ≥ 415
Cross Direction N/mm2 A 409 ≥ 345
Compared to the electrical tracking index V IEC60112Method PLC 3 PLC 3

 

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