Dekai Industry
Products
DK-C150/DK-P150
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/99 specifications (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)
Category：
Application
Computers, instruments, communication equipment, automobiles, cameras, etc.
Tg
155
Td
365
CTE
2.8
Details
Test Item | Unit | Test Condition | Typical Value | Specification value | |
|---|---|---|---|---|---|
Tg | ℃ | DSC | 155 | ≥ 150 | |
Z-axis CTE | ppm/℃ | <Tg | 48 | ≤ 60 | |
ppm/℃ | >Tg | 239 | ≤ 300 | ||
% | 50-260℃ | 2.8 | ≤ 3.5 | ||
Surface Resistance | MΩ | After moisture resistance | 2.9X10E7 | ≥ 10E3 | |
Volume Resistance | MΩ· cm | After moisture resistance | 4.9X10E8 | ≥ 10E3 | |
Dielectric Constant 1MHz | - | C- 24/23/50 | 4.7 | ≤ 5.4 | |
Dissipation Factor 1MHz | - | C- 24/23/50 | 0.014 | ≤ 0.035 | |
Arc Resistance | sec | D-48/50 D-0.5/23 | 181 | ≥ 60 | |
Dielectric Breakdown | KV | D-48/50 D-0.5/23 | 45+ KV,NB | ≥ 40 | |
Water Absorption | % | D-24/23 | 0.13 | ≤ 0.5 | |
Flammability | - | C- 24/23/50 E-24/125 | 94V-0 | 94V-0 | |
Td | ℃ | 10℃/MIN, N2, 5%Wt Loss | 365 | ≥ 325 | |
T288 | min | TMA | >60 | ≥ 5 | |
T260 | min | TMA | >60 | ≥ 30 | |
Peel Strength(HTE 1OZ) | N/mm | 125℃ | 1.4 | ≥ 0.7 | |
Float288 ℃/10Sec | 1.6 | ≥ 1.05 | |||
Thermal Stress | Unetched | sec | Float288 ℃/10Sec | >120 | ≥ 10 |
Etched | |||||
bending strength | Length Direction | N/mm2 | A | 509 | ≥ 415 |
Cross Direction | N/mm2 | A | 409 | ≥ 345 | |
Comparative Tracking Index (CTI) | V | IEC60112Method | PLC 3 | PLC 3 | |
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