DK160/DK160P

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DK160/DK160P


■ PN curing, utilizing a special resin crosslinking with Tg > 150°C <br/> ■ Exhibits excellent heat resistance, featuring a low coefficient of thermal expansion, superior through-hole capability, and outstanding CAF resistance. <br/> ■ Meets the specification requirements of IPC-4101/99 (lead-free, high Td, low thermal expansion coefficient)

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