Tg
Td
CTE
condition:
clear condition
Features
■ PN curing, Tg greater than 190 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)
Application
Suitable for high multilayer PCB, computer, communication, automotive electronics, etc
Features
■ Halogen-free (Cl or Br<900ppm) 、Tg value > 150℃、CTI value≥600V
■ Excellent CAF resistance
■ Excellent mechanical processibility andthermal resistance
■ Low Z-CTE, lead free process compliancy
■ Excellent CAF resistance
■ Excellent mechanical processibility andthermal resistance
■ Low Z-CTE, lead free process compliancy
Application
New energy vehicles, computers, instrumentation, communication equipment, etc.
Features
■ Halogen-free (Cl or Br<900ppm) 、Tg value > 170℃、CTI value≥600V
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes
Application
New energy vehicles, computers, instrumentation, communication equipment, office equipment, etc.
Description
Features
■ Halogen-free (Cl or Br<900ppm)
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process
Application
Smart phones, tablet computers, automotive electronics, communication equipment, etc.
Features
■ Halogen-free (Cl or Br<900ppm)
Excellent heat resistance, Td greater than 350 ℃
■ Low Z-direction thermal expansion coefficient
Excellent heat resistance, Td greater than 350 ℃
■ Low Z-direction thermal expansion coefficient
Application
Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.
Description
Features
■ Halogen-free (Cl or Br<900ppm)
■ Tg>170℃
■D4.2 (10GHz), two 0.013 (10GHz), R500
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process and anti-CAF function
■ Tg>170℃
■D4.2 (10GHz), two 0.013 (10GHz), R500
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process and anti-CAF function
Application
Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.
Description