DK170GC/DK170GP

■ Halogen-free (Cl or Br<900ppm)
Excellent heat resistance, Td greater than 350 ℃
■ Low Z-direction thermal expansion coefficient

Application

Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.

Tg

175

Td

390

CTE

2.4

Details

Test Item Unit Treatment conditions Typical value Specification value
Tg °C DSC 175 ≥ 170
Z-axis CTE ppm/°C <Tg 45 ≤ 60
ppm/°C >Tg 210 ≤ 300
% 50-260°C 2.4 ≤ 3.0
surface resistivity After moisture resistance 2.5X10E6 ≥ 10E4
E-24/ 125 2.2X10E6 ≥ 10E3
volume resistivity MΩ· cm After moisture resistance 3.4X10E7 ≥ 10E4
E-24/ 125 3.7X10E7 ≥ 10E3
Dielectric constant 1MHz - C- 24/23/50 4.5 ≤ 5.4
Dielectric loss 1MHz - C- 24/23/50 0.012 ≤ 0.035
Arc resistance sec D-48/50 D-0.5/23 135 ≥ 60
breakdown voltage KV D-48/50 D-0.5/23 45 KV,NB ≥ 40
water absorption % D-24/23 0.1 ≤ 0.8
Flame resistance - C- 24/23/50 E-24/125 94V-0 94V-0
Td thermal decomposition temperature °C 10°C/MIN, N2, 5%Wt Loss >309 ≥ 340
≥ 340
T288 min TMA >60 ≥ 15
T260 min TMA >60 ≥ 30
Peel strength N/mm 125 °c 、 float288 °c/10sec 1.2、 1.3 ≥ 0.7 、 ≥ 1.05
thermal stress unetched sec Float288 °C/10Sec >300 ≥ 10
Etched
bending strength Length Direction N/mm2 A 515 ≥ 415
Cross Direction N/mm2 A 430 ≥ 345
Compared to the electrical tracking index V IEC60112Method PLC 2 PLC 2

 

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