Dekai Industry
Products
DK170GC/DK170GP
Excellent heat resistance, Td greater than 350 ℃
■ Low Z-direction thermal expansion coefficient
Category：
Application
Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.
Tg
180
Td
390
CTE
2.3
Details
| Test Items | Units | Tes Condition | Typical value | Specification | |
|---|---|---|---|---|---|
| Tg | °C | DSC | 180 | ≥ 170 | |
| Z-axis CTE | ppm/°C | <Tg | 45 | ≤ 60 | |
| ppm/°C | >Tg | 210 | ≤ 300 | ||
| % | 50-260°C | 2.3 | ≤ 3.0 | ||
| Surface Resistivity | MΩ | After moisture resistance | 2.5X10E6 | ≥ 10E4 | |
| E-24/ 125 | 2.2X10E6 | ≥ 10E3 | |||
| Volume Resistivity | MΩ· cm | After moisture resistance | 3.4X10E7 | ≥ 10E4 | |
| E-24/ 125 | 3.7X10E7 | ≥ 10E3 | |||
| Dielectric Constant 1MHz | - | C- 24/23/50 | 4.5 | ≤ 5.4 | |
| Dissipation Factor 1MHz | - | C- 24/23/50 | 0.012 | ≤ 0.035 | |
| Arc Resistance | sec |
D-48/50+ D-0.5/23 |
135 | ≥ 60 | |
| Dielectric Breakdown | KV | D-48/50+ D-0.5/23 | 45+ KV NB | ≥ 40 | |
| Water Absorption | % | D-24/23 | 0.15 | ≤ 0.8 | |
| Flamemability | - | C- 24/23/50+ E-24/125 | 94V-0 | 94V-0 | |
| Td | °C | 10°C/MIN, N2, 5%Wt Loss | 390 | ≥ 340 | |
| T288 | min | TMA | >60 | ≥ 15 | |
| T260 | min | TMA | >60 | ≥ 30 | |
| Peel Strength(HTE HOZ) | N/mm | 125 °c 、 float288 °c/10sec | 1.2、 1.3 | ≥ 0.7 、 ≥ 1.05 | |
| Thermal Stress | Unetched | sec | Float288 °C/10Sec | >300 | ≥ 10 |
| Etched | |||||
| Flexmal Strength | Length Direction | N/mm2 | A | 515 | ≥ 415 |
| Cross Direction | N/mm2 | A | 430 | ≥ 345 | |
| Compared Tracking Index | V | IEC60112Method | PLC 2 | PLC 2 | |
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