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DK170GC/DK170GP

■ Halogen-free (Cl or Br<900ppm)
Excellent heat resistance, Td greater than 350 ℃
■ Low Z-direction thermal expansion coefficient

Category：

Halogen-free compatible FR-4.1

Application

Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.

180

390

CTE

2.3

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Details

Test Item		Unit	Treatment conditions	Typical value	Specification value
Tg		°C	DSC	180	≥ 170
Z-axis CTE		ppm/°C	<Tg	45	≤ 60
		ppm/°C	>Tg	210	≤ 300
		%	50-260°C	2.3	≤ 3.0
surface resistivity		MΩ	After moisture resistance	2.5X10E⁶	≥ 10E⁴
surface resistivity		MΩ	E-24/ 125	2.2X10E⁶	≥ 10E³
volume resistivity		MΩ· cm	After moisture resistance	3.4X10E⁷	≥ 10E⁴
volume resistivity		MΩ· cm	E-24/ 125	3.7X10E⁷	≥ 10E³
Dielectric constant 1MHz		-	C- 24/23/50	4.5	≤ 5.4
Dielectric loss 1MHz		-	C- 24/23/50	0.012	≤ 0.035
Arc resistance		sec	D-48/50+ D-0.5/23	135	≥ 60
breakdown voltage		KV	D-48/50+ D-0.5/23	45+ KV,NB	≥ 40
water absorption		%	D-24/23	0.15	≤ 0.8
Flame resistance		-	C- 24/23/50+ E-24/125	94V-0	94V-0
Td thermal decomposition temperature		°C	10°C/MIN, N₂, 5%Wt Loss	390	≥ 340
T288		min	TMA	>60	≥ 15
T260		min	TMA	>60	≥ 30
Peel strength(HTE HOZ)		N/mm	125 °c 、 float288 °c/10sec	1.2、 1.3	≥ 0.7 、 ≥ 1.05
thermal stress	unetched	sec	Float288 °C/10Sec	>300	≥ 10
thermal stress	Etched	sec	Float288 °C/10Sec	>300	≥ 10
bending strength	Length Direction	N/mm²	A	515	≥ 415
bending strength	Cross Direction	N/mm²	A	430	≥ 345
Compared to the electrical tracking index		V	IEC60112Method	PLC 2	PLC 2

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Telephone：+86-0752-3532018

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Email：MKT02@dekgf.com

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DK170GC/DK170GP

SAF Coolest v1.3 设置面板NOASX-ZWVH-NFADE-ZQD

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