Dekai Industry
Products
DK170GMF/DK170GMP
■ Tg>170℃
■D4.2 (10GHz), two 0.013 (10GHz), R500
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process and anti-CAF function
Category：
Application
Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.
Tg
190
Td
385
CTE
2.1
Details
| Test Items | Units | Test Condition | Typical value | Specification | |
|---|---|---|---|---|---|
| Tg | °C | DSC | 190 | ≥ 170 | |
| Z-axis CTE | ppm/°C | <Tg | 41 | ≤ 60 | |
| ppm/°C | >Tg | 200 | ≤ 300 | ||
| % | 50-260°C | 2.1 | ≤ 3.5 | ||
| Aurface Resistance | MΩ | After moisture resistance | 3.0X10E7 | ≥ 10E4 | |
| Volume Resistance | MΩ· cm | After moisture resistance | 8.2X10E7 | ≥ 10E4 | |
| Dielectric Constant 10GHz | - | C- 24/23/50 | 4.1 | ≤ 5.4 | |
| Dissipation Factor 10GHz | - | C- 24/23/50 | 0.0108 | ≤ 0.035 | |
| Arc Resistance | sec | D-48/50+ D-0.5/23 | 181 | ≥ 60 | |
| Dielectric Breakdown | KV | D-48/50+ D-0.5/23 | 45 +KV,NB | ≥ 40 | |
| Water Absorption | % | D-24/23 | 0.1 | ≤ 0.8 | |
| Flammability | - | C- 24/23/50+ E-24/125 | 94V-0 | 94V-0 | |
| Td | °C | 10°C/MIN, N2, 5%Wt Loss | 385 | ≥ 325 | |
| T288 | min | TMA | >60 | ≥ 5 | |
| T260 | min | TMA | >60 | ≥ 30 | |
| Peel Strength(HTE 1OZ) | N/mm | 125 °c 、 float288 °c/10sec | 1.25、 1.3 | ≥ 0.7 、 ≥ 1.05 | |
| Thermal Stress | Unetched | sec | Float288 °C/10Sec | 150 | ≥ 10 |
| Etched | |||||
| Flexural Strength | Length Direction | N/mm2 | A | 532 | ≥ 415 |
| Cross Direction | N/mm2 | A | 434 | ≥ 345 | |
| Compared Tracking Index | V | IEC60112Method | PLC 2 | PLC 2 | |
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