DK170GMF/DK170GMP

■ Halogen-free (Cl or Br<900ppm)
■ Tg>170℃
■D4.2 (10GHz), two 0.013 (10GHz), R500
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process and anti-CAF function

Application

Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.

Tg

175

Td

390

CTE

2.8

Details

Test Item Unit Treatment conditions Typical value Specification value
Tg °C DSC 175 ≥ 170
Z-axis CTE ppm/°C <Tg 45 ≤ 60
ppm/°C >Tg 238 ≤ 300
% 50-260°C 2.8 ≤ 3.0
surface resistivity After moisture resistance 3.0X10E7 ≥ 10E4
≥ 10E4
volume resistivity MΩ· cm After moisture resistance 8.2X10E7 ≥ 10E4
≥ 10E4
Dielectric constant 1MHz - C- 24/23/50 4.2 ≤ 5.4
Dielectric loss 1MHz - C- 24/23/50 0.012 ≤ 0.035
Arc resistance sec D-48/50 D-0.5/23 181 ≥ 60
breakdown voltage KV D-48/50 D-0.5/23 45 KV,NB ≥ 40
water absorption % D-24/23 0.13 ≤ 0.5
Flame resistance - C- 24/23/50 E-24/125 94V-0 94V-0
Td thermal decomposition temperature °C 10°C/MIN, N2, 5%Wt Loss >390 ≥ 325
≥ 325
T288 min TMA >60 ≥ 5
T260 min TMA >60 ≥ 30
Peel strength N/mm 125 °c 、 float288 °c/10sec 1.25、 1.3 ≥ 0.7 、 ≥ 1.05
thermal stress unetched sec Float288 °C/10Sec 150 ≥ 10
Etched
bending strength Length Direction N/mm2 A 532 ≥ 415
Cross Direction N/mm2 A 434 ≥ 345
Compared to the electrical tracking index V IEC60112Method PLC 3 PLC 3

 

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