Tg
Td
CTE
condition:
clear condition
Features
■PN cured, Tg greater than 170°C
■ Excellent heat resistance, low Z-direction thermal expansion coefficient, and superior through-hole capability
■ Meets the requirements of IPC-4101/126 standards (lead-free, high Td, low Z-axis thermal expansion coefficient, CAF-resistant)
■ Excellent heat resistance, low Z-direction thermal expansion coefficient, and superior through-hole capability
■ Meets the requirements of IPC-4101/126 standards (lead-free, high Td, low Z-axis thermal expansion coefficient, CAF-resistant)
Application
Computer and communication equipment, high-end instruments, routers, etc.
Features
■ PN curing, Tg greater than 190 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)
Application
Suitable for high multilayer PCB, computer, communication, automotive electronics, etc
Features
■ Halogen-free (Cl or Br<900ppm) 、Tg value > 150℃、CTI value≥600V
■ Excellent CAF resistance
■ Excellent mechanical processibility andthermal resistance
■ Low Z-CTE, lead free process compliancy
■ Excellent CAF resistance
■ Excellent mechanical processibility andthermal resistance
■ Low Z-CTE, lead free process compliancy
Application
New energy vehicles, computers, instrumentation, communication equipment, etc.
Features
■ Halogen-free (Cl or Br<900ppm) 、Tg value > 170℃、CTI value≥600V
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes
■ Excellent resistance to ion migration
■ Excellent machinability and heat resistance
■ Low coefficient of Z-directional thermal expansion and compatibility with lead-free processes
Application
New energy vehicles, computers, instrumentation, communication equipment, office equipment, etc.
Features
■ Halogen-free (Cl or Br<900ppm)
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process
■Excellent machinability and heat resistance
■ Low Z-direction thermal expansion coefficient, compatible with lead-free process
Application
Smart phones, tablet computers, automotive electronics, communication equipment, etc.
Features
■ Halogen-free (Cl or Br<900ppm)
Excellent heat resistance, Td greater than 350 ℃
■ Low Z-direction thermal expansion coefficient
Excellent heat resistance, Td greater than 350 ℃
■ Low Z-direction thermal expansion coefficient
Application
Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.