Tg
Td
CTE
condition:
clear condition

Features

■ Tetrafunctional epoxy resin is designed for higher UV-Blocking, better dimensional stability and through hole capability
■ Excellent tracking resistance, CTI≧ 600V
■Excellent mechanical properties, electrical properties, chemical properties
■ Compliant with IPC-4101/97

Application

Plasma, LCD, power substrate, TV, washing machine, etc.

Features

■ Tetrafunctional epoxy resins are designed for higher UV-Blocking, better dimensional stability and through-hole capability.
■ Low water absorption, UV-block and AOI compatible, flame retardant up to UL 94V-0
■Excellent heat resistance, mechanical properties, electrical properties, chemical properties
■ Compliant with IPC-4101/97

Application

Computer, instrument, communication equipment, automotive electronics, power supply, etc.

Features

■ Tg 135±5 ℃, lead-free compatible FR-4.0 sheet
■ Low water absorption, UV-blocking and AOI compatible, flame retardant up to UL 94V-0
■Excellent heat resistance, low thermal expansion coefficient, good resistance to CAF
■ Comply with the specification requirements of IPC-4101/101.

Application

Automotive electronics, instrumentation, communication equipment, power supply, etc.

Features

■ PN curing, Tg greater than 150 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/99 specifications (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Computers, instruments, communication equipment, automobiles, cameras, etc.

Features

■ PN curing, using special resin cross-linked Tg>150°C
■ Excellent heat resistance, low coefficient of thermal expansion and superior through-hole capability and anti-CAF capability
■ Meets IPC-4101/99 specifications (lead-free, high Td, low coefficient of thermal expansion)

Application

Mini Led, computer, instrument, communication equipment, car, camera, etc.

Features

■ PN curing, Tg greater than 170 ℃
■ Excellent heat resistance, low Z-direction thermal expansion coefficient and superior through-hole capability
■ Meets IPC-4101/126 specification (lead-free, high Td, low Z-direction thermal expansion coefficient, anti-CAF)

Application

Computer and communication equipment, high-end instruments, routers, etc.
< 12 > proceed page