DK170GLF/DK170GLFP

■ Halogen-free (Cl or Br<900ppm)
■ Tg>190℃(TMA)
■Dk4.1 (10GHz), Df 0.00070 (10GHz), RC55%
■Excellent mechanical processibility andthermal resistance
■ Low Z-CTE,lead free process compliancy,AntiCAF

Application

Smart phones, tablet computers, automotive electronics, communication equipment, routers, etc.

Tg

190

Td

390

CTE

2.0

Details

Test Items Units Test Condition Typical value Specification
Tg °C TMA 190 ≥ 180
Z-axis CTE ppm/°C <Tg 34 ≤ 60
ppm/°C >Tg 174 ≤ 300
% 50-260°C 2.0 ≤ 3.0
Aurface Resistance After moisture resistance 3.0X10E7 ≥ 10E4
Volume Resistance MΩ· cm After moisture resistance 8.2X10E7 ≥ 10E4
Dielectric Constant 10GHz - C- 24/23/50 4.1 ≤ 5.4
Dissipation Factor 10GHz - C- 24/23/50 0.0070 ≤ 0.035
Arc Resistance sec D-48/50+ D-0.5/23 181 ≥ 60
Dielectric Breakdown KV D-48/50+ D-0.5/23 45 +KV,NB ≥ 40
Water Absorption % D-24/23 0.1 ≤ 0.8
Flammability - C- 24/23/50+ E-24/125 94V-0 94V-0
Td °C 10°C/MIN, N2, 5%Wt Loss 390 ≥ 325
T288 min TMA >60 ≥ 5
T260 min TMA >60 ≥ 30
Peel Strength(RTF HOZ) N/mm (RTF HOZ) 0.58 ≥ 0.53
Thermal Stress Unetched sec Float288 °C/10Sec 150s ≥ 10
Etched
Flexural Strength Length Direction N/mm2 A 532 ≥ 415
Cross Direction N/mm2 A 434 ≥ 345
Compared Tracking Index(CTI) V IEC60112Method PLC 2 PLC 2

 

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