First knowledge of copper clad laminate: you need to know the basic knowledge of copper clad laminate


Basic concept of 1. copper clad laminate

Copper clad laminate refers to a piece of substrate, by chemical or mechanical means on the surface of the production of a layer of copper foil, in order to make the circuit on it. Copper clad laminate has electrical conductivity and good welding performance, as well as excellent mechanical strength and corrosion resistance. Therefore, it is one of the basic materials commonly used in the electronics industry.

Manufacturing Process of 2. Copper Clad Laminate

The main process of copper clad laminate production includes graphic design, draft making, photosensitive photoresist coating, exposure, etching, resist removal and drilling. Among them, photoresist and exposure are the most critical steps in the production process, and their quality directly affects the quality and performance of copper clad laminate.

Application of 3. Copper Clad Laminate in Electronic Industry

Copper Clad Laminate has many important applications in the electronics industry. For example, it can be used to make printed circuit boards (PCBs), which are a vital part of almost all electronic equipment. At the same time, the copper clad laminate can also be used for the production of high-frequency circuit boards, semiconductor chip carrier boards and distribution principle boards and other electronic devices.

The Importance and Development Prospect of 4. Copper Clad Laminate

With the rapid development of the electronics industry, the demand for high-performance, high-density and high-reliability electronic devices is increasing, making the demand for copper-clad laminates is also increasing. In the future, copper clad laminate technology will be more mature and professional, and the production efficiency and quality of copper clad laminate will be further improved.

In short, copper clad laminate is one of the very important and key basic materials in the electronics industry and has a wide range of application prospects.

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